CEM follows a proven product development process that is based on ISO 9001 standards. This state-of-the-art process has been designed to incorporate concurrent design methodologies, experienced program management and leading edge development tools.
Our design services form a critical first step in supporting customers throughout the entire product life cycle. Leveraging expertise in electronic products manufacturing, CEM works with its customers to strengthen product design & shorten time-to market.
Our design focus on flexibility providing a solution that is the right fit for customer requirements. CEM will develop a comprehensive skill set to serve customer needs in this critical stage of Electronic Manufacturing services such as:
Design for Manufacturability (DFM)
Design for Production (DFP)
Manufacturing process instruction (MPI)
Process Management plans (PMP)
Tooling development & automation of the assembly line process
Design for Quality (DFQ)
Critical parameter control plan (CPCP)
Statistical Quality control
From pre-design to post installation, CEM works closely with customers to provide tailored test engineering & development solutions.
Printed Circuit Assembly (PCA) offers the latest SMT technology & processes, combined with state-of-the-art quality management systems, on a global scale. The company specializes in high volume, high complexity mixed technology by using SMT machines. Our SMT is having capacity to placement like Ball Grid Array(BGA), QFP & connector.
CEM offers assembly & both in-circuit & functional testing from the company’s. All facilities feature state-of the-art equipment with 3D solder volume paste, AOI & X-ray inspection capabilities, complemented by a tight process monitoring.
Our assembly services are complemented by front-end product development capabilities including strong design experience. Our first Motto is QUALITY.
- MIN : 0402 chip ( up to 0201 can be handle )
- MAX : 45x45mm Squre parts / 45x150mm (Connectors)
- Double sided, Mirrored BGA assembly
- Double sided, single reflow processing
- Fine pitch high pin count press fit connectors
- Flip chip
- Lead free assembly
- Continuous flow SMT lines
- Optical splicing
CEM Commitment to quality is evidenced by Continuous improvement of the day-to-day operations in our factory. CEM actively investigates new strategies & quality concepts for evaluation & inclusion into standard quality processes & tools. Standardization of CEM core processes & methodologies, combined with lean manufacturing, promotes total employee involvement & excellence in Manufacturing.
From Pre-design to Post-installation, CEM works closely with customers to provide tailored test engineering & development solutions. To maintain test efficiency, we continually evaluate product test flow & cycle time Optimization, ultimately we can trim costs, reduce downtime & improve yields.
- Burn In
- ICT – in circuit test
- Functional verification test (FVI)
- Surface mount technology
- Mixed Technology assemblies
- Fine pitch QFP,QFN
- BGA, Micro-BGA,
- Systems and Box Build
- Functional Test
- Device Programming
- Automated Optical Inspection
|Screen Printers – DEK ELAI & MPM||
|Paste Inspection Cyber Optics SE300||
|Fuji XP-142E & CP-732E||
|Fuji XP-242E & XP-243E||
|Reflow Oven – Vitronics Soltec XPM 520 & BTU||
|EMS Wave Sodlering||
|In-circuit tester. Concorde make Model T 800 FV||
|HP 5DX X-Ray Inspection Series II machine||
Programmer LP- 456
All our products could be designed to comply with these EU directives providing Independent proof of compliance, including component vendor’s conformity self declarations of each component type.
Vendors supplying products to CEM-Solutions also comply with the requirements of above mentioned, and are responsible for ensuring that their component suppliers also provide proof of conformity.