Manufacturing

CEM follows a proven product development process that is based on ISO 9001 standards. This state-of-the-art process has been designed to incorporate concurrent design methodologies, experienced program management and leading edge development tools.

Our design services form a critical first step in supporting customers throughout the entire product life cycle. Leveraging expertise in electronic products manufacturing, CEM works with its customers to strengthen product design & shorten time-to market.

Our design focus on flexibility providing a solution that is the right fit for customer requirements. CEM will develop a comprehensive skill set to serve customer needs in this critical stage of Electronic Manufacturing services such as:

Design for Manufacturability (DFM)
Design for Production (DFP)
Manufacturing process instruction (MPI)
Process Management plans (PMP)
Tooling development & automation of the assembly line process

Design for Quality (DFQ)
Critical parameter control plan (CPCP)
Statistical Quality control

From pre-design to post installation, CEM works closely with customers to provide tailored test engineering & development solutions.

SMTAssembly

Printed Circuit Assembly (PCA) offers the latest SMT technology & processes, combined with state-of-the-art quality management systems, on a global scale. The company specializes in high volume, high complexity mixed technology by using SMT machines. Our SMT is having capacity to placement like Ball Grid Array(BGA), QFP & connector.

CEM offers assembly & both in-circuit & functional testing from the company’s. All facilities feature state-of the-art equipment with 3D solder volume paste, AOI & X-ray inspection capabilities, complemented by a tight process monitoring.

Our assembly services are complemented by front-end product development capabilities including strong design experience. Our first Motto is QUALITY.

PCB Capabilities

0603 chip
CCGA
COB
CSPS
Double sided, Mirrored BGA assembly
Double sided, single reflow processing
Fine pitch high pin count press fit connectors
Flip chip
Lead free assembly
uBGA
Continuous flow SMT lines
Optical splicing

Quality

CEM Commitment to quality is evidenced by Continuous improvement of the day-to-day operations in our factory. CEM actively investigates new strategies & quality concepts for evaluation & inclusion into standard quality processes & tools. Standardization of CEM core processes & methodologies, combined with lean manufacturing, promotes total employee involvement & excellence in Manufacturing.

Testing Development

From Pre-design to Post-installation, CEM works closely with customers to provide tailored test engineering & development solutions. To maintain test efficiency, we continually evaluate product test flow & cycle time Optimization, ultimately we can trim costs, reduce downtime & improve yields.

Capabilities

5DX
AOI
Burn In
ICT – in circuit test
Functional verification test (FVI)
Diagnostic
X-ray

Facilities

Surface mount technology
Mixed Technology assemblies
Fine pitch QFP,QFN
BGA, Micro-BGA,
Systems and Box Build
Functional Test
Device Programming
Automated Optical Inspection

Infrastructure

Screen Printers – DEK ELAI & MPM	Auto vision system- cognex 5000. Under stencil cleaner wet/dry. Stencil standard 29x29 frame size. Max Board Size: 20"x 16"(508mm x 406mm). Max Print Area: 18"x 16"(457.2mm x 406.4mm).
Paste Inspection Cyber Optics SE300	100% 3D Solder Paste Inspection for fine pitch. 3D Height, True Volume and Area Measurements.
Fuji CP42 & CP 732 E Chip shooters	PCB Size 50mm sq to 356 x 254mm. 0201, 2010, SO 8 & SO16. Accuracy +/- 0.066mm @ 3 sigma +/- 0.132mm @ 6 sigma. No. Of Components / Hour – 50,000.
GSM Precision placer	PCB Size – 16” x 18”. BGA down to 0603 component. Platform Tray Feeder. Speed - 5,000 CPH. Accuracy - +0.1mm.
Reflow Oven – Vitronics Soltec XPM 520 and BTU.	Air/N2 Ready. Five heating zones.
In-circuit tester. Concorde make Model T 800 FV	Checks IC Missing and orientation. Ten highest component failure display. Auto guarding and Pin number search function. Self diagnostic function & Loop test. A fixed voltage generator offers a fast method of charging the Capacitors and saves time during test.
HP 5DX X-Ray Inspection Series II machine	Automatic analysis of joints. High repeatability measurements. Accurate good/bad decisions. Display of cross sectional images. High fault coverage, typically 98% of process defects.
Air-VAC BGA Rework Station DRS 26	Max. Board Size: 250 x 400 mm. VISION: 3 in. x 3 in. max. Comp. size.
Data I/O PP100 Programmers	Flexible and Quality programmer/handler with vision. High level of quality and reliability. Up to 600 devices per hour for devices with programming times less than 80 Seconds with any packaged format.
AOI-YES Tech	100% inspection of chip & fine pitch components Inspection capability:- Throughput up to 5sq .in/sec>component per hour Minimum component size-0201; 01005 with high magnification option

ROHS Compliance

All our products could be designed to comply with these EU directives providing Independent proof of compliance, including component vendor’s conformity self declarations of each component type.

Vendors supplying products to CEM-Solutions also comply with the requirements of above mentioned, and are responsible for ensuring that their component suppliers also provide proof of conformity.

Next generation network based VoIP Technology

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