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Our SMT Unit

CEM follows a proven product development process that is based on ISO 9001 standards. This state-of-the-art process has been designed to incorporate concurrent design methodologies, experienced program management and leading edge development tools.

Our design services form a critical first step in supporting customers throughout the entire product life cycle. Leveraging expertise in electronic products manufacturing, CEM works with its customers to strengthen product design & shorten time-to market.

Our design focus on flexibility providing a solution that is the right fit for customer requirements.
CEM will develop a comprehensive skill set to serve customer needs in this critical stage of Electronic Manufacturing services such as:

Manufacturing

  • Design for Manufacturability (DFM)
  • Design for Production (DFP)
  • Manufacturing process instruction (MPI)
  • Process Management plans (PMP)
  • Tooling development & automation of the assembly line process

Quality Control

  • Design for Quality (DFQ)
  • Critical parameter control plan (CPCP)
  • Statistical Quality control

Testing

From pre-design to post installation, CEM works closely with customers to provide tailored test engineering & development solutions.

SMT Assembly

Printed Circuit Assembly (PCA) offers the latest SMT technology & processes, combined with state-of-the-art quality management systems, on a global scale.
The company specializes in high volume, high complexity mixed technology by using SMT machines. Our SMT is having capacity to placement like Ball Grid Array(BGA), QFP & connector.

CEM offers assembly & both in-circuit & functional testing from the company’s. All facilities feature state-of the-art equipment with 3D solder volume paste, AOI & X-ray inspection capabilities, complemented by a tight process monitoring.

Our assembly services are complemented by front-end product development capabilities including strong design experience. Our first Motto is QUALITY.

PCB Capabilities

  • 0603 chip
  • CCGA
  • COB
  • CSPS
  • Double sided, Mirrored BGA assembly
  • Double sided, single reflow processing
  • Fine pitch high pin count press fit connectors
  • Flip chip
  • Lead free assembly
  • uBGA
  • Continuous flow SMT lines
  • Optical splicing

Quality

CEM Commitment to quality is evidenced by Continuous improvement of the day-to-day operations in our factory.
CEM actively investigates new strategies & quality concepts for evaluation & inclusion into standard quality processes & tools.
Standardization of CEM core processes & methodologies, combined with lean manufacturing, promotes total employee involvement & excellence in Manufacturing.

Testing Development

From Pre-design to Post-installation, CEM works closely with customers to provide tailored test engineering & development solutions.
To maintain test efficiency, we continually evaluate product test flow & cycle time Optimization, ultimately we can trim costs, reduce downtime & improve yields.

Capabilities

  • 5DX
  • AOI
  • Burn In
  • ICT – in circuit test
  • Functional verification test (FVI)
  • Diagnostic
  • X-ray